KUALA LUMPUR, April 12 – Vertiv (NYSE: VRT) has introduced the Vertiv™ CoolLoop Trim Cooler, a high-density, hybrid cooling solution designed to support AI and high-performance computing (HPC) applications. Engineered for liquid and air-cooled data centers, the system enhances energy efficiency by reducing cooling energy consumption by up to 70% and optimizing space savings by 40%.
Its scalable design supports fluctuating water temperatures, allowing seamless integration with liquid-cooled environments, including direct-to-chip and immersion cooling systems. With Asia’s rapid digital transformation, Vertiv’s latest cooling innovation is tailored to high-density AI infrastructure, reducing CO2 emissions while ensuring compliance with 2027 EU F-GAS regulations.
Offering scalable cooling capacity up to 3 MW, the CoolLoop Trim Cooler simplifies installation, lowers operational complexity, and delivers a future-ready energy-efficient cooling solution for AI-driven industries.
