KUALA LUMPUR, May 10 — Intel Foundry brought together over 1,000 customers and ecosystem partners at its Direct Connect 2025 event in San Jose, unveiling its latest advancements in process technology, advanced packaging, and manufacturing capabilities.
CEO Lip-Bu Tan emphasized Intel’s commitment to building a world-class foundry, announcing progress on the Intel 14A process node, new Intel 18A variants, and significant developments in domestic U.S. production, including the successful wafer run at Arizona’s Fab 52.
The event also marked the launch of expanded ecosystem alliances, including the Intel Foundry Chiplet Alliance, aimed at delivering secure, interoperable solutions across key markets. With collaborations involving Synopsys, Cadence, Siemens EDA, MediaTek, Microsoft, and Qualcomm, Intel underscored a systems foundry approach to enable customer success.
Advanced packaging innovations, including EMIB-T and new Foveros architectures, reinforce Intel’s strategy to lead in next-generation semiconductor design and manufacturing.
