KUALA LUMPUR, September 2 – Malaysia is taking bold steps to cement its position in the global semiconductor industry, said Minister of Higher Education YB Dato’ Seri Diraja Dr. Zambry Abd Kadir during the officiating speech at the 32nd IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 2025.
Highlighting the nation’s 13% contribution to global back-end semiconductor capacity and RM200 billion in annual exports, he emphasised the strategic importance of connecting higher education with industry to build a future-ready talent pool and drive technological innovation.
Speaking at the educational workshop held alongside the symposium, Dr. Zambry outlined key initiatives such as partnerships between USM and leading global semiconductor players like TSMC and Intel, the IC design apprenticeship programme, and the APEL-based Master’s Programme endorsed by major industry names.
With the demand for skilled professionals in IC design projected to reach 10,000 in five years, he stressed that Malaysia’s competitive edge hinges on equipping graduates with real-world skills and leadership capabilities, aligning with the nation’s vision under Malaysia MADANI.
