KUALA LUMPUR, December 2 — Malaysia’s role in the global semiconductor supply chain received a major boost today as Intel Corporation announced an additional RM860 million investment to establish the country as its assembly and test operations hub.
Prime Minister Datuk Seri Anwar Ibrahim said the move signals strong confidence in Malaysia’s long-term economic direction, particularly under the New Industrial Master Plan 2030. He added that Intel has also expressed appreciation for the government’s continued support.
Especially for its RM12 billion advanced packaging facility in Penang, which is now 99% complete. The announcement came during a courtesy visit by Malaysian-born Intel CEO Lip-Bu Tan, where discussions centred on strengthening Malaysia’s competitiveness in high-quality investments and the semiconductor ecosystem.
Anwar also highlighted Intel’s collaboration with education and training institutions, which has seen RM2.8 million committed to research, development, and elective programmes over the past two years.
He said the continued investments underscore Malaysia’s position as a trusted innovation partner, bolstering local talent development and reinforcing the nation’s standing in the global semiconductor landscape.
