GEORGE TOWN, June 6 — FusionAP has secured a US$2 million pre-seed funding round co-led by Vertex Ventures Southeast Asia & India and Southern Capital Group.
To expand advanced semiconductor packaging research and pilot production in Malaysia. Founded by former Intel and TSMC veterans.
FusionAP plans to strengthen engineering, research and intellectual property development for 2.5D and 3D semiconductor packaging technologies.
The funding is also supported by a matching research grant from the Ministry of Science, Technology and Innovation.
Founder Ooi Teng Chow said the company aims to become a key outsourced semiconductor assembly and test player in advanced packaging.
The startup is also a founding member of the Malaysia Advanced Packaging Consortium, supporting efforts to move Malaysia higher up the semiconductor value chain, beyond traditional assembly and testing operations.
